04-13-2012 02:28 AM
I did not really get to know what are the FBG and FFG packages, and the differences between both of them.
I'm thinking about using a Kintex-7 900-pin 325T, but I don't know what is the package I 'd better choose.
Is there any special advantage of one of them in term of cost, speed, PCB mounting? Is there one of them targeted for a special application?
I need some help to properly choose the device. Any good documentation, link?
Solved! Go to Solution.
04-13-2012 08:07 AM
Flip chip packages have superior signal integrity (our patented sparse chevron technology).
Wire bond packages are less expensive, but may not be able to operate at high IO speeds (transceivers, memory interfaces), as have as many interfaces operating at the same time.
So, for highest transceiver speeds, and highest memory interface speeds, and use of all IOs at moderate IO drive strengths, flip chip is needed (almost surely).
There are also codes that tell you if the package uses lead solder, or non-lead solder bumps (for ROHS requirements where applicable).
Xilinx San Jose
04-14-2012 08:56 PM
Have you tried typing your question into Google? If not you should before posting.
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