04-13-2012 02:28 AM
I did not really get to know what are the FBG and FFG packages, and the differences between both of them.
I'm thinking about using a Kintex-7 900-pin 325T, but I don't know what is the package I 'd better choose.
Is there any special advantage of one of them in term of cost, speed, PCB mounting? Is there one of them targeted for a special application?
I need some help to properly choose the device. Any good documentation, link?
04-14-2012 08:56 PM
04-13-2012 08:07 AM
Flip chip packages have superior signal integrity (our patented sparse chevron technology).
Wire bond packages are less expensive, but may not be able to operate at high IO speeds (transceivers, memory interfaces), as have as many interfaces operating at the same time.
So, for highest transceiver speeds, and highest memory interface speeds, and use of all IOs at moderate IO drive strengths, flip chip is needed (almost surely).
There are also codes that tell you if the package uses lead solder, or non-lead solder bumps (for ROHS requirements where applicable).
04-14-2012 08:56 PM
04-24-2012 08:30 PM
07-25-2016 06:42 PM
What about the FBV package? I have been through UG475 (7 Series FPGAs Packaging), DS180 (7 Series FPGAs Overview), UG112 (Device Package User Guide), & DS192 (Kintex-7 FPGAs Data Sheet: DC and AC Switching Characteristics)
I have found no mention of the difference between an FBG and FBV package.
Where is the difference documented?
09-29-2016 03:53 PM
I will forward a Xilinx answer to my own question.
"The V package is RoHS compliant with no exemption. In pratical terms that means solder bumps are lead free on V package devices."
06-27-2017 05:13 PM
After some more digging I found that the G means the flip chip solder balls connecting the substrate to the die have lead, but the substrate balls (those visible to end-user) are lead-free. This is also known as the 'exemption 15'.
The V versions have NO lead.