Editor’s Note: This content is contributed by Susan Cheng, Marketing manager for industrial vision at Xilinx
Did you catch the recent launch of our new Artix® UltraScale+™ FPGA and Zynq® UltraScale+ MPSoC products? These new devices represent a new level of compute density perfect for compact edge devices. And with new InFO packaging from TSMC, they offer up to 60% smaller and 70% thinner options compared to existing products.
The new UltraScale+ FPGAs and MPSoCs in InFO packaging enable a new level of industrial performance, ideal for compact, intelligent edge products such as smart machine vision cameras. Trends in industrial camera development today demand increased intelligence, resolution, and speed. At the same time, camera developers are challenged with decreasing size, power, and cost. Our new white paper explores those camera requirements, and gives examples of how some customers and partners are leveraging Xilinx solutions to meet those requirements. It describes trends in camera sensors, interface standards, reliability, and more.
Zynq UltraScale+ Devices in InFO Packaging
Lucid Vision Labs’ Triton Edge camera represents one of the first products leveraging these new products. Lucid worked closely with Xilinx using the new UltraScale+ ZU3 device in InFO packaging, to squeeze an “amazing” amount of processing power into an ultra-compact IP67, factory tough camera.
Triton Edge Camera with InFO Packaging
How will YOU use this new level of compute density? What applications can you see for these new products?