Similar to the soldering and cleaning processes Xilinx does not have any specific/detailed recommendations or guidance on conformal coating aside from your general ones that can be applied to most other semiconductors in the industry. However customers should define their own approach as it depends on their own board assembly process and on design/board-specific requirements to preserve the FPGA from any moisture related issue based on the application of the device and design requirements. We have general recommendations on conformal coating in regards to what not to do such as not using Toluene based conformal coating. This is detailed in XAPP427 and UG475/575.
XAPP427:
https://www.xilinx.com/support/documentation/application_notes/xapp427.pdf
UG575:
https://www.xilinx.com/support/documentation/user_guides/ug575-ultrascale-pkg-pinout.pdf
Regards,
T
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