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578 Views
Registered: ‎04-13-2017

Pin compatible

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Hi,

 

I designed a board with XC7K325T-FBG676, and I want to test it with XC7K325T-FFG676. 

I would like to know if the tow packages are pin compatible without any design changes.

 

Thanks.

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1 Solution

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Moderator
Moderator
551 Views
Registered: ‎09-18-2014

Re: Pin compatible

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@avrumw,

 

They are footprint compatible. The thing you need to know is that the FBG package provides sub-par PI/SI compared to FFG packages thus limiting performance rates. In addition to this FBG packages do not have dedicated VCCAUX_IO pins bonded out. This can be seen from the pinouts with no designation for the VCCAUX group. This limits DDR3 rates from achieving the highest possible due to the implementation needed a dedicated 2.0V VCCAUX_IO supply. 

 

fbg676comp.JPG

fbg676footcomp.JPG

 

Regards,

T

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3 Replies
Moderator
Moderator
577 Views
Registered: ‎09-18-2014

Re: Pin compatible

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Blingbling-eyes,

 

Yes, that's fine they are pin compatible. Really you should be looking at the Kintex-7 product table or 7-series product selection guide, as those answer your question. Infact going from FBG to FFG you gain additional performance window which was not there in FBG due to the package design. For example GTX line rate max is increased for FFG. There may be others. Review the data sheet as well as the user guides for the particular design implementation used.

 

kinGTZ7.JPG

 

Regards,

Tezz

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Historian
Historian
555 Views
Registered: ‎01-23-2009

Re: Pin compatible

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I am not sure that they are pin compatible. There are different pin files for the two different packages FBG676

and FFG676.

 

These files are not identical - I don't know if the differences between them mean they are incompatible or not, but the fact that there are two files leads me to believe they may not be completely compatible...

 

Avrum

 

 

 

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Moderator
Moderator
552 Views
Registered: ‎09-18-2014

Re: Pin compatible

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@avrumw,

 

They are footprint compatible. The thing you need to know is that the FBG package provides sub-par PI/SI compared to FFG packages thus limiting performance rates. In addition to this FBG packages do not have dedicated VCCAUX_IO pins bonded out. This can be seen from the pinouts with no designation for the VCCAUX group. This limits DDR3 rates from achieving the highest possible due to the implementation needed a dedicated 2.0V VCCAUX_IO supply. 

 

fbg676comp.JPG

fbg676footcomp.JPG

 

Regards,

T

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Don’t forget to reply, kudo, and accept as solution.
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