Questions related to Xilinx PCN XTP526 (v1.1) March 30, 2020
Reference : Table 13, section 5.1 Non-tin plating
Non-tin plating such as Nickel/Palladium/Gold, Nickel/Gold or Nickel/Palladium, do not have Sn whisker problems and should be considered for lead-frame applications. This plating a more than a ten year history of field use, 1992 to present . Non-tin plating, however, does have other potential issues including adhesion to mold compounds which need to be evaluated prior to product conversion.
1) The PPF lead frame in the subject PCN contains Nickel/Palladium/Gold/Copper. Does that make it susceptible to the potential issues as mentioned?
2) If the answer is yes, how do we evaluate the impact?
3) If issues are found as a result of evaluation e.g. adhesion to mold compounds, what do we do next?
4) What are the other potential issues and what is the resolution?