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Registered: ‎02-26-2020

XC7Z030-1FBG676C : contradiction in footprint recommandation in UG1099 and UG865 (appendix A)

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Hi

We are creating the footprint for the XC7Z030-1FBG676C and we have found 2 documents with footprint recommandation for the FBG676 package in the ZYNQ documentations.

UG1099 and UG865.

Both documentations have different recommandations for the solder land and soldermask opening.

UG1099:Solder land --> 0.4mm Solder Mask opening--> .43mm

UG865: Solder land --> 0.53mm Solder Mask opening--> .63mm

We were wondering which one is the right one for this FPGA.

Thank you

Caroline

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Moderator
Moderator
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Registered: ‎07-23-2015

@carolinepaulin Stick to UG865 as that is meant for Zynq-7000.

I will check on the discrepancy and get back.

- Giri
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Moderator
Moderator
305 Views
Registered: ‎07-23-2015

@carolinepaulin Stick to UG865 as that is meant for Zynq-7000.

I will check on the discrepancy and get back.

- Giri
--------------------------------------------------------------------------------------------------------------------
There's no such thing as a stupid question. Feel free to ask but do a quick search to make sure it ain't already answered.
Keep conversing, give Kudos and Accept Solution when you get one.
-----------------------------------------------------------------------------------------------------------------------

View solution in original post

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Moderator
Moderator
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Registered: ‎09-18-2014

Hello Carolinepaulin,

where in ug1099 has recommendation for 1mm pitch for zynq?

 

Regards,

T

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Registered: ‎02-26-2020

Hi

 

in UG1099, there is information for the 1.00mm, FB package, both in mm and mils.

If UG1099 is no longer good for Zynq devices, please make sure it doesnt appear in the documentation list.  

We will use UG865 appendix A recommendation.

thank you.

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