I'm going to work on thermal-aware task placement on FPGAs.
I have to know a lot about FPGA and CLBs temperature and power (target independent notes are more preferable)
Would you please introduce some text or books which discuss temperature and power and their relation in FPGAs?
Thanks a lot in advance
The approximate relation between Power dissipation (PD), TJ(Junction temperature) and TA(Ambient temperature) can be representing with the following equation.
PD = (TJ –TA)/ θJA-Overall Where QJA is overall thermal resistance between junction to ambient.
FYI: By using XPE/XPA/Vivado-Power tools customer can easily find out what is the power consumption for his design, Junction temperature
Visit the below Power Solutions web link to find more documents/training material about power & temperature issues http://www.xilinx.com/products/design_resources/power_central