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2,641 Views
Registered: ‎06-27-2017

SPARTAN 6 TEMPERATURE DISSIPATION

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Hi, I would like to know how to prevent thermal problems with SPARTAN 6 FPGA.

 

Mainly I want to know the following:

 

-          Thermal resistance from capsule to the air

-          How good dissipation is through GND pads

-          Is it better to dissipate the heat through the capsule to the air (heatsink), or would it be better to do it through GND pads in the BGA having a GND plane which is then in contact with the air or something like that?

-          How do the different packages affect to thermal behaviour?

 

Thank you in advance,

 

Regards,

 

Ángela

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1 Solution

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Scholar austin
Scholar
4,645 Views
Registered: ‎02-27-2008

Re: SPARTAN 6 TEMPERATURE DISSIPATION

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a,

 

Roughly half the heat is passed through the bottom of the device package into the PCB through all of the balls/pins.

 

Thus, not having other hot parts near the device helps remove heat from the die,  conversely, hot parts near the device will make the die hotter (not good practice).

 

Airflow is the means of heat removal, so no airflow limits power dissipation (use the spreadsheet power estimator to look at heat sinks, airflow, power, and junction temperatures).

 

https://www.xilinx.com/products/technology/power/xpe.html

 

The junction to environment thermal resistance for packages is here:

 

https://www.google.com/url?sa=t&rct=j&q=&esrc=s&source=web&cd=1&cad=rja&uact=8&ved=0ahUKEwiw98KGn97UAhXmwlQKHdtCCjMQFggiMAA&url=https%3A%2F%2Fwww.xilinx.com%2Fsupport%2Fdocumentation%2Fuser_guides%2Fug385.pdf&usg=AFQjCNFgKolkEkUoC9dixVhX3fe7-WzK8g

 

page 344 (start of section for device package data)

 

 

 

 

 

 

Austin Lesea
Principal Engineer
Xilinx San Jose
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1 Reply
Scholar austin
Scholar
4,646 Views
Registered: ‎02-27-2008

Re: SPARTAN 6 TEMPERATURE DISSIPATION

Jump to solution

a,

 

Roughly half the heat is passed through the bottom of the device package into the PCB through all of the balls/pins.

 

Thus, not having other hot parts near the device helps remove heat from the die,  conversely, hot parts near the device will make the die hotter (not good practice).

 

Airflow is the means of heat removal, so no airflow limits power dissipation (use the spreadsheet power estimator to look at heat sinks, airflow, power, and junction temperatures).

 

https://www.xilinx.com/products/technology/power/xpe.html

 

The junction to environment thermal resistance for packages is here:

 

https://www.google.com/url?sa=t&rct=j&q=&esrc=s&source=web&cd=1&cad=rja&uact=8&ved=0ahUKEwiw98KGn97UAhXmwlQKHdtCCjMQFggiMAA&url=https%3A%2F%2Fwww.xilinx.com%2Fsupport%2Fdocumentation%2Fuser_guides%2Fug385.pdf&usg=AFQjCNFgKolkEkUoC9dixVhX3fe7-WzK8g

 

page 344 (start of section for device package data)

 

 

 

 

 

 

Austin Lesea
Principal Engineer
Xilinx San Jose
0 Kudos