01-03-2020 05:25 PM
We are planning to use the 2 following parts (XCKU115-2FLVB1760I and XQKU060-1RFA1156M) in space flight applications that require mechanical qualification testing. Typically we use blank packages with daisy chained leads to implement this testing. However we have not been able to successfully locate blank substrates of either of these 2 package types. Can you please point me to an appropriate source or Xilinx contact that can help me? Thanks Benny Piepgrass
01-05-2020 05:31 AM
01-06-2020 07:13 AM
Unfortunaltly live packages have many power & ground pins around the perifery and corners.
These are the high stress areas where our testing needs to focus.
Does anyone have contact info for the BGA packaging group?
01-08-2020 03:28 AM
@bpiepgrass You need to touch base with your FAE who can check on the daisy chain and mechanical packages for you.
01-08-2020 08:42 AM - edited 01-08-2020 10:24 AM
@bpiepgrass I am checking with our distributor partner FAE if they are covering you. I will update once I hear back.
Edit: Update: George N from Avnet will be reaching out to you soon Benny.