These are usually located in UG1075 however I see it is not updated with these newer gen 3 RFSOC devices yet. Not a surprise since I see most of the data is still provided access via the lounge. I assume you know that these are obtained using JEDEC setup/parameters so they will not really be reflective of real world application. They maybe good for comparing different base device package thermal characteristic at a glance. We also provide thermal models as well which you can use to build a more realistic application of your full thermal set up and simulate with for more accurate results. I will PM resistance values for now.
Don’t forget to reply, kudo, and accept as solution.