UPGRADE YOUR BROWSER

We have detected your current browser version is not the latest one. Xilinx.com uses the latest web technologies to bring you the best online experience possible. Please upgrade to a Xilinx.com supported browser:Chrome, Firefox, Internet Explorer 11, Safari. Thank you!

cancel
Showing results for 
Search instead for 
Did you mean: 
Visitor ecavaliere
Visitor
423 Views
Registered: ‎11-28-2018

VIRTEX 4 XC4VFX60 heatspreader

Jump to solution

Does they Virtex 4 VFX heat spreader have vent holes?  

Can these be soldered and cleaned with a aqueous chemistry?  what are the restrictions if any?  Do they need to be baked after cleaning?

0 Kudos
1 Solution

Accepted Solutions
Xilinx Employee
Xilinx Employee
389 Views
Registered: ‎06-06-2018

Re: VIRTEX 4 XC4VFX60 heatspreader

Jump to solution

Hi @ecavaliere,

Since Virtex 4 devices are offered exculsilvely with Thermally efficient flip chip BGA Packages.

Please refer this XAPP426 (v 1.4), which may be helpful for your query regarding cleaning heat sink, recommendation and steps.

Regards,

DEEPAK D N

-------------------------------------------

Please reply or Kudo or Mark it as an Accepted Solution.

--------------------------------------------

0 Kudos
2 Replies
Xilinx Employee
Xilinx Employee
390 Views
Registered: ‎06-06-2018

Re: VIRTEX 4 XC4VFX60 heatspreader

Jump to solution

Hi @ecavaliere,

Since Virtex 4 devices are offered exculsilvely with Thermally efficient flip chip BGA Packages.

Please refer this XAPP426 (v 1.4), which may be helpful for your query regarding cleaning heat sink, recommendation and steps.

Regards,

DEEPAK D N

-------------------------------------------

Please reply or Kudo or Mark it as an Accepted Solution.

--------------------------------------------

0 Kudos
Moderator
Moderator
352 Views
Registered: ‎05-02-2017

Re: VIRTEX 4 XC4VFX60 heatspreader

Jump to solution

 

hi @ecavaliere @ddn,

 

Xilinx flip-chip packages are not hermetically sealed and exposure to cleaning solvents and chemicals or excessive moisture during boards assembly could pose serious package reliability concerns. Small vents are kept by design between the heatspreader (lid) and the organic substrate to allow for outgassing and moisture evaporation of epoxies in the lid adhesive and underfill material. Solvents or other corrosive chemicals could seep through these vents and attack the organic materials and components inside the package, and hence, are strongly discouraged during board assembly of Xilinx flipchip BGA packages.


It is highly recommended to use either a no-clean solder paste or a water soluble solder paste.
If cleaning is required, then a water soluble solder paste should be used.


Most major PCB assembly subcontractors today have successfully developed the no-clean process in which post assembly washing is not required. That would be an ideal process. If cleaning is required as part of the process, then it is recommended to use a water soluble paste and then wash with deionized water in a washer, such as a Westek Triton III at 140F - 145F. Cleaning solutions or solvents are not recommended as some cleaning solutions may contain chemicals that could attack the heatspreader adhesive, thermal compound, or the components inside the package.


For more clarification, refer to the following application note:
http://www.xilinx.com/support/documentation/application_notes/xapp426.pdf.

 

Chandra .

-------------------------------------------

Please reply or Kudo or Mark it as an Accepted Solution.

--------------------------------------------

 

 

Regards
Chandra sekhar
----------------------------------------------------------------------------------------------
Kindly note- Please mark the Answer as "Accept as solution" if solution provided is helpful.

Give Kudos to a post which you think is helpful and reply oriented.
----------------------------------------------------------------------------------------------
0 Kudos