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28nm 3D IC FPGAs now in full production

Xilinx Employee
Xilinx Employee
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Last week, Xcell Daily presented a video showing error-free 100Gbps data transmission over a Finisar CFP2 optical link using four 28Gbps GTZ serial transceivers in a Virtex-7 H580T 3D IC FPGA. (See “100Gbps Ethernet over CFP2 optical modules crosses 10km of fiber with zero errors using Virtex-7 H580T FPGA.”) This week, Xilinx and TSMC announced (and Electronics Weekly reported) that the entire Virtex-7HT 3D IC FPGA family including the Virtex-7 H580T is in full, volume production. These devices are based on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) 3D IC process, which provides significant silicon scaling, power, and performance benefits over and above the benefits of Moore’s Law scaling baked into every Xilinx 28nm 7 series All Programmable FPGA and SoC.


The Virtex-7 H580T is a great example of the benefits of the TSMC CoWoS 3D IC process, which among other things, makes the H580T’s sixteen rock-solid 28Gbps SerDes transceivers possible.  The TSMC CoWoS 3D IC process also enables the inclusion of 2M logic cells in the Virtex-7 2000T 3D IC FPGA—a capacity that’s simply not possible with monolithic chip fabrication at 28nm.  The Virtex-7 2000T is the largest FPGA shipping in production volume from any FPGA vendor and it’s been available since late 2011.



Virtex-7 H580T 3D IC FPGA.jpg

Xilinx Virtex-7 H580T 3D IC FPGA based on TSMC's CoWoS 3D IC process technology



By the way, just as a reminder, the Virtex-7 H580T 3D IC FPGA took the top place over 11 other contenders in the SoC and Programmable Logic category in the 2013 Innovation Awards organized by the Italian electronics magazine Selezione di Elettronica.