Although he didn’t remove the heat sink in this teardown video, Dave explains that Siglent told him there’s a Zynq SoC under the heat sink. The SDS-1202X-E used a Zynq Z-7020 SoC. We don’t know from Dave’s video which Zynq SoC Siglent’s engineers used in the SDS-1104X-E design. However, this is an all-new board design for Siglent with two ADCs instead of one. Even so, the previously used Zynq Z-7020 may well be able to handle the extra few differential-pair I/O lines from the second ADC and, because the SDS-1104X-E is a 1Gsamples/sec DSO, the total data rate with all four channels enabled is 2Gsamples/sec, which is the same as the SDS-1202X-E DSO’s maximum data rate.
Siglent’s SDS-1202X-E and SDS-1104X-E DSOs once again highlight the Zynq SoC’s flexibility and capability when used as the foundation for a product family. The Zynq SoC’s unique combination of a dual-core Arm Cortex-A9 MPCore processing subsystem and a good-sized chunk of Xilinx 7 series FPGA permits the development of truly high-performance platforms.
Here’s Dave’s teardown video for your edification: