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WeizheJabil
Newbie
Newbie
157 Views
Registered: ‎04-16-2021

XCVU29P-2FSGA2577E || Recommended reflow profile / stencil opening and footprint opening || K_IXIA

Could you please advise the recommended reflow profile/stencil opening and footprint opening of following part?

MPN: XCVU29P-2FSGA2577E
MFR: XILINX

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barriet
Xilinx Employee
Xilinx Employee
134 Views
Registered: ‎08-13-2007

I usually start here:
https://www.xilinx.com/support/documentation/user_guides/ug112.pdf (Device Package User Guide)

but there's some useful information here as well:
https://www.xilinx.com/support/documentation/application_notes/xapp426.pdf (Implementing Xilinx Flip-Chip BGA Packages)
https://www.xilinx.com/support/documentation/application_notes/xapp427.pdf (Implementation and Solder Reflow Guidelines for Pb-Free Packages)

as well as here since the FS package is lid-less with stiffener ring:
https://www.xilinx.com/support/documentation/application_notes/xapp1301-mechanical-thermal-design-guidelines.pdf (Mechanical and Thermal Design Guidelines for Lidless Flip-Chip Packages)

Cheers,
bt

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