cancel
Showing results for 
Search instead for 
Did you mean: 
Highlighted
Participant
Participant
1,353 Views
Registered: ‎09-07-2017

Heat Sink Pressure

Jump to solution

hello All

      we want to design heat sink attachments for Bare-die FB Packages(XCZU2EG-484SB).refer ug1075 Figure12-2. we use a metal heat sink on sillicon through Thermal Gap Filler. but I don't know how many pressure we can press the chip. 10psi or 20psi? or more?

Thank you

heat sink.png
0 Kudos
1 Solution

Accepted Solutions
Highlighted
Scholar
Scholar
1,942 Views
Registered: ‎02-27-2008

Re: Heat Sink Pressure

Jump to solution

UG1075:

 

"RECOMMENDED: Xilinx recommends that the applied pressure on the package be in the range of 20 to
40 PSI for optimum performance of the thermal interface material (TIM) between the package and the
heat sink. Thermocouples should not be present between the package and the heat sink, as their
presence will degrade the thermal contact and result in incorrect thermal measurements. The best
practice is to select the appropriate pressure (in the 20 to 40 PSI range) for the optimum thermal
contact performance between the package and the thermal system solution, and the mechanical
integrity of the package (with the thermal solution to pass all mechanical stress and vibration
qualification tests)."

Austin Lesea
Principal Engineer
Xilinx San Jose

View solution in original post

0 Kudos
3 Replies
Highlighted
Scholar
Scholar
1,943 Views
Registered: ‎02-27-2008

Re: Heat Sink Pressure

Jump to solution

UG1075:

 

"RECOMMENDED: Xilinx recommends that the applied pressure on the package be in the range of 20 to
40 PSI for optimum performance of the thermal interface material (TIM) between the package and the
heat sink. Thermocouples should not be present between the package and the heat sink, as their
presence will degrade the thermal contact and result in incorrect thermal measurements. The best
practice is to select the appropriate pressure (in the 20 to 40 PSI range) for the optimum thermal
contact performance between the package and the thermal system solution, and the mechanical
integrity of the package (with the thermal solution to pass all mechanical stress and vibration
qualification tests)."

Austin Lesea
Principal Engineer
Xilinx San Jose

View solution in original post

0 Kudos
Highlighted
Participant
Participant
1,268 Views
Registered: ‎09-07-2017

Re: Heat Sink Pressure

Jump to solution

Thank you very much! @austin

I saw this comment at page 150,but i am not sure whether it can used to bare-die flip-chip packages.

0 Kudos
Highlighted
Moderator
Moderator
1,231 Views
Registered: ‎07-23-2015

Re: Heat Sink Pressure

Jump to solution

@zebulon Do refer to this XAPP1301 which will help you for your heat sink design

- Giri
--------------------------------------------------------------------------------------------------------------------
There's no such thing as a stupid question. Feel free to ask but do a quick search to make sure it ain't already answered.
Keep conversing, give Kudos and Accept Solution when you get one.
-----------------------------------------------------------------------------------------------------------------------
0 Kudos