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Lift-off! 16nm Zynq UltraScale+ MPSoC ships to customers. From tapeout to “Hello World” in 2.5 months.

by Xilinx Employee ‎09-30-2015 08:23 AM - edited ‎01-06-2016 11:35 AM (47,495 Views)

The date September 30 has been circled in red for a few weeks here at Xilinx HQ. It’s the ahead-of-schedule date Xilinx planned to announce first customer shipments of the 16nm Zynq UltraScale+ MPSoC, which taped out last July. (See “We have Tapeout! Xilinx Zynq UltraScale+ MPSoC ready for TSMC’s 16FF+ process.”) Well, today is September 30 and Xilinx has announced first customer shipments of the Zynq UltraScale+ MPSoC.

 

I love it when a plan comes together—even better when faster than planned.

 

Just a quick reminder:

 

The Xilinx Zynq UltraScale+ MPSoC simply has a lot more of everything including:

 

  • Quad-core, 64/32-bit ARM Cortex-A53 processor for immense application-processing power
  • Dual-core, 32-bit ARM Cortex-R5 processor for real-time and safety-critical software execution
  • ARM Mali-400 MP GPU for implementing high-performance graphics, offloading these tasks from the on-chip ARM Cortex-A53 CPUs and the ARM Cortex-R5 real-time processors
  • A hardened H.265/264 Video Codec Unit that provides native UltraHD compression
  • Dedicated Security Processing Unit with multiple military-class security protocols to prevent any conceivable unauthorized access
  • Hardened, integrated SDRAM memory controller supporting DDR4, LPDDR4, DDR3, DDR3L, and LPDDR3 memory devices
  • Large arrays of Xilinx UltraScale+ programmable logic including the new, larger embedded UltraRAM blocks; a large number of UltraScale DSP48E2 slices; and hardened, integrated PCIe Gen2/Gen3/Gen4 and 100G Ethernet blocks
  • Xilinx programmable I/O that can handle anything from simple logic pins to high-speed PCIe and 100G+ Ethernet serial protocols

 

 

Now, it’s one thing to simply say that we’ve shipped the product. Showing you a photo of a live Zynq UltraScale+ MPSoC is another thing entirely, so here you go:

 

 

 

Zynq UltraScale MPSoC on a Characterization Board.jpg

 

16nm Xilinx Zynq UltraScale+ MPSoC

 

 

 

That’s a live Xilinx Zynq UltraScale+ MPSoC XCZU9EG device soldered to the board.

 

Well, it’s one thing to show you a photo of a finished device on a board and yet another thing entirely to show you a photo of that device running on a board, so here you go:

 

 

 

Zynq UltraScale MPSoC on a Characterization Board Overall shot.jpg

 

 

16nm Xilinx Zynq UltraScale+ MPSoC

 

 

 

Note the lack of a heat sink on the characterization board in the above photo. Yes, the XCZU9EG device was powered up and running when I captured this image. I’m told the TSMC 16FF+ process used to fabricate the Zynq UltraScale+ MPSoC has some mighty nice low-power characteristics and that naked chip on the right-hand side of the board certainly tends to confirms this. (Note: That’s not to say that you’ll never need to use a heat sink with Zynq UltraScale+ MPSoC devices; It sort of depends on what you’re doing with the device, doesn’t it? You’ll note that the characterization board was designed to accommodate a heat sink.)

 

But a still image doesn’t really prove it’s running, does it? So here’s a short, 4-minute video by Xilinx's Director of Embedded Software Development Zach Pfeffer showing the 16nm Zynq UltraScale+ MPSoC running code in its multiple cores with a great explanation of how you boot up a heterogeneous machine like the Zynq UltraScale+ MPSoC.

 

 

 

 

Initial Zynq UltraScale+ MPSoC devices are shipping now. General sampling begins in Q1, 2016.

 

A hearty Xcell Daily congratulations to all of the people who designed, verified, fabricated, and tested the Zynq UltraScale+ MPSoC! And, thanks to all of you.